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ACCEPT AND PROCEED

Product

Edgebond

Edgebond

Edgebond

Product ID: Nearby Chip Rubber Cementing Agent - Edgebond

The Edgebond usually fix the BGA / CSP chip in 4 corner to achieve the adhesive. It does not like the Underfill need to seep completely to the flip chip base to achieve the completely fixed. Works with the Edgebond does not need preheating nor putting into over for the Underfill to seep completely to the flip chip, this reduced the working-hour and the gel quantity. It may rework, therefore the cost is also low.

Specifications:
  • Applies in:
    • Slim & Light notebook.
    • Vehicle electron.
See more complete detail
X19331 Reworkable Edgebond Adhesive
TYPICAL PROPERTIES -
Color Translucent White
Viscosity (cps) SSA#14,1RPM,25°C 300,000
Cure Conditions, minutes -
110°C 30
120°C 5
150°C 1
Specific Gravity 1.16
Shelf Life@ -5°C, months 6
Pot Life@ 25°C, days 14
CURED PROPERTIES ( 150℃/1MINUTE ) -
CTE, ppm/°C 70
Tg, °C 70
Shear Storage Modulus, GPa 1.1
Volatiles Content, wt% loss on cure  
Contact Detail
TEL:886-2-27662626
FAX:886-2-27663737
Email:richard.lin@ezbond.com.tw ; john.chou@ezbond.com.tw
URL:http://www.ezbond.com.tw
ZIP:110

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