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The Edgebond usually fix the BGA / CSP chip in 4 corner to achieve the adhesive. It does not like the Underfill need to seep completely to the flip chip base to achieve the completely fixed. Works with the Edgebond does not need preheating nor putting into over for the Underfill to seep completely to the flip chip, this reduced the working-hour and the gel quantity. It may rework, therefore the cost is also low.
