Underfill(Board Level Underfill for BGA/CSP/FO-WLPs)

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Underfill

Product ID: Board Level Underfill for BGA/CSP/FO-WLPs

Zymet's high reliability underfill encapsulants both ruggedize and enhance board level reliability. Their thermomechanical properties make them suited for enterprise, automotive, and other harsh environment applications. At the same time, they are high speed underfills that offer unsurpassed flow and cure speeds, making them the preferred choice amongst those working with very large packages, including BGA's, FO-WLP's.

Specifications:

Applies in:
- The Handset/Mobile phone.
- Memory stick.
- Removable hard-discs.
- Bluetooth earphone.
- Used to encapsulate BGA / CSP / Flip to enhance their resistance of vibration and reliability in a wide array of application.