About Ezbond Chemical , (Taiwan) - Healthy and peaceful electronic xi alkone product, Paternity Testing, Veterinary DNA Testing, Species Identification, Hepatitis Viral Load, HBV Real-Time Quantitation, HBV RealQuant, HBV RealType, Genotyping, Laboratory Accreditation, COLA, TAF, Proficiency Test, Cancer Gene Identification, Target Medicine, EGFR, Molecular Biology, DNA Sequencing, Fragment Analysis, Real-Time Quantitation, PCR.

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High Tech Electronic Products

Dow Corning Silicone Electronic Product - Adhesive/ Sealant Material (01)

Dow Corning Silicone electronic Product - Encapsulant Material (02)

Dow Corning Silicone electronic Product - Conformal Coating Material (03)

Dow Corning Silicone electronic Product - Thermal Conductive Material (04)

Dow Corning Silicone electronic Product - Thermal Conductive Pad (05)

Industrial Used then Medicinal Preparation

UL Industrial Rubber - Adhesive (01)

UL Industrial Encapsulanat / Conformal Coating (02)

Lubricating Oil Applies to Plastics (03)

Biotechnology Product

Veterinary Medicine (01)

Human Medicine (02)

Basic Research (03)

LED Packaging

Dow Corning Silicone Electronic Product ¡V LED Packaging (06)

Electrical Machinery / Electron Industry

Panacol UV Light Curing Glue - Electrical Machinery / Electron Industry (01)
Panacol UV Light Curing Rubber - LCD Liquid-Crystal Display Module (02)
Panacol UV Light Curing Rubber - PCB Electric Road Board Assembly (04)
Panacol UV Light Curing Rubber - Smart Card (05)
Panacol UV Light Curing Rubber - Medical Devices (06)
Panacol UV Light Curing Rubber - Glass Bonding (07)

Hoenle-UV Photo Source Equipment

Fiber Optical Bluepoint Source (Hoenle Bluepoint 2 Easycure / Bluepoint 4 Ecocure / Bluepoint 4)
UV Surface-Photo (Hoenle UVHAND 250)
Bluepoint LED (Hoenle Bluepoint LED)
UV Surface Irradiation (Hoenle UVASPOT 400T/1000/2000 (03EUV Lighting))
UVACUBE (Hoenle UVACUBE 100 / 400 / 2000)
LED UV- Pen / LED Power Pen (Hoenle LED UV-Pen / LED Power Pen)
UV Meter (01)

Zymet Underfill Encapsulants

Underfill (Zymet Underfill Encapsulants - BGA/CSP Underfill Encapsulants)
Edgebond (Nearby Chip Rubber Cementing Agent - Edgebond)

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