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ACCEPT AND PROCEED

Product

Edgebond

Edgebond

Edgebond

Product ID: Corner Bond Adhesive

Edgebond adhesives, sometimes referred to as Corner Glues or Cornerbond Adhesives, are an excellent alternative to board-level underfills. Process cost is reduced by the elimination of board preheat and capillary flow. Quality is improved because voids and incompatibility with flux residues are moot. Rework is far easier, further reducing cost. Zymet's reworkable edgebond adhesives provide all this, as they ruggedize and enhance the board level reliability of challenging electronic assemblies, even for enterprise and automotive applications.

Specifications:
  • Applies in:
    • Slim & Light notebook.
    • Vehicle electron.
Features:
  • Reworkable
  • SAC / Low Temperature Solder Assembly
  • Enhance Board Level Reliability (BLR)
  • Improve Shock and Drop Reliability
  • High Tg and Low CTE for the most challenging assemblies and applications
  • Fast, in-line curing with cure time as short as 1 minute
Contact Detail
TEL:886-2-27662626
FAX:886-2-27663737
Email:richard.lin@ezbond.com.tw ; john.chou@ezbond.com.tw
URL:http://www.ezbond.com.tw
ZIP:110

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